Quality Testing Methods for PCB Castellated Holes

PCB RunnerPCB Runner
5 min read

Printed Circuit Boards (PCBs) are integral to modern electronics, and their design and functionality rely on precision at every stage of manufacturing. Among the many design features that enhance PCB usability, castellated edges PCB stand out as one of the most versatile. Castellated holes, also known as half-vias, are small plated through-holes positioned along the board’s edges. These features allow smaller boards or modules to be soldered onto larger motherboards, ensuring seamless electrical connections and compact designs.

However, the functionality of these connections depends heavily on quality assurance. A castellated circuit board must undergo robust testing methods to guarantee reliability, durability, and long-term performance. Without proper inspection and testing, these vital connections may result in weak solder joints, signal disruptions, or complete circuit failure.

This blog highlights the most effective quality testing methods for castellated holes, ensuring manufacturers and engineers achieve reliable PCBs with high performance.

Why Quality Testing Matters in Castellated Holes

The importance of quality testing in castellated edges PCB lies in its role in interconnection. Since castellated holes act as bridges between two boards, even minor flaws in plating, alignment, or solderability can impact the functionality of the overall system. Testing methods ensure:

  • Strong and defect-free plating around castellated holes.

  • Consistent conductivity for signal and power transfer.

  • Durability against mechanical stress and thermal cycles.

  • Compatibility with soldering and reflow processes.

By verifying these factors, manufacturers reduce the risks of failures in applications such as wireless modules, breakout boards, and IoT devices.

Key Testing Methods for Castellated Holes

Quality testing methods for castellated holes in PCBs involve a combination of visual, mechanical, and electrical inspections. Below are the most widely used techniques:

1. Visual Inspection

Visual inspection is the first step to check for obvious defects. Using magnification tools or automated optical inspection (AOI), manufacturers look for issues such as:

  • Incomplete plating on castellated edges.

  • Misalignment of holes along the PCB border.

  • Cracks or burrs around the hole edges.

  • Solder bridging or residue that may hinder connectivity.

This step quickly identifies flaws before boards move to advanced testing stages.

2. X-Ray Inspection

X-ray imaging allows manufacturers to view hidden features inside the plated castellated holes. This technique is particularly valuable for:

  • Detecting voids or incomplete plating within the hole walls.

  • Ensuring proper copper thickness and uniform coverage.

  • Identifying hidden cracks or fractures that may compromise durability.

X-ray inspection is non-destructive and provides high-resolution insights into internal structures.

3. Cross-Sectional Analysis

Cross-sectional analysis involves cutting a sample PCB to physically examine the internal structure of castellated holes under a microscope. Although destructive, it provides invaluable insights, including:

  • Uniformity of copper plating thickness.

  • Quality of via wall adhesion.

  • Detection of micro-cracks or delamination.

This method is often used during prototyping or process validation.

4. Solderability Testing

Since castellated holes serve as soldering points between modules, their solderability must be tested. Methods include:

  • Applying solder paste and evaluating the ease of wetting.

  • Checking for consistent flow across castellated edges.

  • Ensuring no solder voids or skips that could weaken joints.

Poor solderability may lead to weak connections or reflow failures.

5. Electrical Continuity and Isolation Testing

Electrical testing verifies that castellated holes establish proper connections and maintain signal integrity. Two common approaches are:

  • Continuity Testing: Ensures electrical signals pass through without resistance.

  • Isolation Testing: Confirms no unwanted shorts occur between castellated vias or adjacent traces.

Automated test equipment (ATE) can quickly verify thousands of points in large production runs.

6. Mechanical Stress Testing

Castellated edges endure mechanical stress when modules are soldered onto larger boards. Stress testing evaluates:

  • The strength of solder joints after repeated mechanical pressure.

  • Durability under bending or thermal expansion.

  • Resistance to vibration and environmental stress.

This method ensures castellated joints can withstand real-world handling and usage.

7. Thermal Cycling Tests

PCBs with castellated edges often experience varying thermal conditions during assembly or operation. Thermal cycling tests simulate extreme temperature variations to check:

  • Expansion and contraction effects on plating.

  • The endurance of solder joints through heating and cooling cycles.

  • Potential delamination or cracking caused by temperature stress.

Boards that pass these tests demonstrate reliability in harsh environments.

8. Microsectioning of Plated Holes

Microsectioning involves embedding the castellated circuit board in resin, slicing it into ultra-thin sections, and analysing under a microscope. It helps in:

  • Assessing plating adhesion.

  • Measuring copper thickness consistency.

  • Identifying defects such as cracks or voids.

Though destructive, it is one of the most accurate testing methods.

9. Impedance Testing

For castellated PCBs used in high-frequency applications, impedance testing ensures consistent signal transmission. It verifies that the castellated holes maintain the required impedance level without distortions or losses.

10. Environmental Testing

Lastly, environmental testing exposes the castellated circuit board to conditions like humidity, salt spray, and dust. This process determines how castellated holes perform in diverse real-world conditions, especially in outdoor or industrial applications.

Best Practices for Ensuring Castellated Hole Quality

Along with testing, certain best practices help manufacturers maintain the quality of castellated edges PCB:

  • Ensure accurate drill alignment for castellated holes.

  • Maintain proper plating thickness for durability.

  • Clean edges to avoid solder bridging.

  • Use automated inspection for consistent quality control.

  • Apply suitable design guidelines for castellated modules.

Conclusion

The reliability of castellated holes is crucial for the seamless performance of PCBs, especially in modular designs and compact applications. By applying a combination of visual, mechanical, electrical, and environmental testing, manufacturers can ensure high standards in performance and durability.

Trusted names like PCB Runner adopt these advanced quality testing methods to ensure castellated features deliver long-term reliability. Whether for IoT modules, wireless solutions, or embedded systems, thorough testing guarantees that castellated edges contribute to strong, dependable PCB connections.

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Written by

PCB Runner
PCB Runner

PCB Runner is a UK-based company offering high-quality PCB fabrication, assembly, and prototyping services, serving global industries with ISO-certified processes and a commitment to precision and reliability.